Embedded control of an Active Structural Integrity Monitoring System using interlaced PZT and Thin-Film Transistors

Award Information
Agency:
Department of Defense
Branch
Defense Advanced Research Projects Agency
Amount:
$750,000.00
Award Year:
2005
Program:
SBIR
Phase:
Phase II
Contract:
W31P4Q-05-C-0266
Award Id:
68844
Agency Tracking Number:
04SB2-0052
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
155C-3 Moffett Park Drive, Sunnyvale, CA, 94089
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
043688410
Principal Investigator:
PinYu
Chief Architect
(408) 745-7872
pin_yu@acellent.com
Business Contact:
AmritaKumar
Director, Business Develo
(408) 745-1188
akumar@acellent.com
Research Institute:
n/a
Abstract
Structural Health Monitoring (SHM) is increasingly being evaluated by the industry as a possible method to improve the safety and reliability of structures and thereby reduce operational cost. However, the scalability and applicability of SHM systems for the monitoring of large structures is still a challenge. The goal of the proposed effort is to develop the capability for enhanced in-situ structural health monitoring of large structures through embedded control of a large number of sensors and actuators. The effort focuses on development of "Flexible Smart Strips" for structural health monitoring. The strips will have the following innovative characteristics: Versatility and flexibility for application to structures of any geometry and configuration, Flexibility for ease of installation even in inaccessible structural areas, Built-in capability for data acquisition and processing, Ability to monitor the integrity of large structural areas, Enhanced damage detection capability, Extreme Portability and Low-cost. The project will leverage the Thin Film Transistor technology to provide benefits of flexibility, cost and performance. Phase I focused on demonstrating the feasibility of the concept while phase II will focus on the flexible smart strip prototype development and implementation issues.

* information listed above is at the time of submission.

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