Smart, Compact Packages for Vibration Control
Small Business Information
215 First Street, Cambridge, MA, 02142
AbstractHerein, ACX proposes to develop compact, low cost, integrated smart packs for vibration reduction. Each package would include actuators and sensors, drive and signal conditioning electronics as well as simple controllers to yield a self standing solution to vibration problems. The electronics module would be low cost and compact. The pack would run off of standard available power supplies and would require minimal interaction, aside from an initial bond and checkout on the structure. These packs provide a protective skin offering electrical isolation and provide a means for integration of sensors, signal conditioning, and control electronics. Producing a compact yet low cost design will require detailed analysis of the thermal dissipation characteristics of the layout as well as the effects of parasitic capacitance due to a tightly packed circuit. It is envisioned that the electronics module will be a composite of multiple layers of flexible circuit populated with components, epoxy and plastic spacer material. In a sense, the module will be a multilayer board with the components as well as the traces embedded inside. The design of the packs will be such that they could be manufactured in high volume and would exhibit high operational reliability and durability. The fabrication of these devices will involve expanding upon existing ACX techniques, currently used to manufacture the QuickPack (TM) as well as passive piezo dampers which incorporate a surface mount shunt resistor. Anticipated Benefits: A completely integrated and inexpensive package for vibration control can be applied to a wide range of DoD and commercial systems include aircraft and submarine problems such as lifting surface motion control, disturbance rejection and flutter suppression, and engine vibration and acoustic noise reduction. Vibration reduction can in some instances improve the lifetime of components by reducing rms strain levels.
* information listed above is at the time of submission.