High Dynamic Range Infrared Scene Projector for Boost Phase Intercept

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$745,601.00
Award Year:
2005
Program:
SBIR
Phase:
Phase II
Contract:
HQ0006-05-C-7249
Award Id:
64033
Agency Tracking Number:
031-0309
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
6238 Covington Way, Goleta, CA, 93117
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
132083697
Principal Investigator:
Steve Solomon
President
(805) 708-5084
jwock@earthlink.net
Business Contact:
Steve Solomon
President
(805) 708-5084
jwock@earthlink.net
Research Institution:
n/a
Abstract
Attaining the temperatures required for simulating future MDA weapons systems such as targets with hot engine exhausts, rocket plumes and infrared countermeasures will require development on numerous fronts, the most challenging and difficult of which is the selection of the materials of which the emitter pixels are fabricated. Resistive heating technology is the most mature of the myriad IR scene projection technologies available today; and hence is the most appropriate and realistic foundation on which to base the development of the next generation of high dynamic range IR scene projectors. Unfortunately, the materials used in fabricating existing generation of devices are not capable of withstanding the ultra-high temperatures required for the next generation of devices. Materials research for this application, performed in a phase 1 effort, has turned up several potential material systems that are expected to be stable at the extreme temperatures required for the next generation of devices (~2500 K or higher). The work outlined in this proposal is aimed at selecting the most promising of the material systems (and deposition techniques) based on process development, annealing experiments and measurements of the properties relevant to ultra-high temperature IRSP performance. Test pixel arrays will be fabricated and tested.

* information listed above is at the time of submission.

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