High Dynamic Range Infrared Scene Projector for Boost Phase Intercept

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0006-05-C-7249
Agency Tracking Number: 031-0309
Amount: $745,601.00
Phase: Phase II
Program: SBIR
Awards Year: 2005
Solicitation Year: 2003
Solicitation Topic Code: MDA03-006
Solicitation Number: 2003.1
Small Business Information
6238 Covington Way, Goleta, CA, 93117
DUNS: 132083697
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Steve Solomon
 (805) 708-5084
Business Contact
 Steve Solomon
Title: President
Phone: (805) 708-5084
Email: jwock@earthlink.net
Research Institution
Attaining the temperatures required for simulating future MDA weapons systems such as targets with hot engine exhausts, rocket plumes and infrared countermeasures will require development on numerous fronts, the most challenging and difficult of which is the selection of the materials of which the emitter pixels are fabricated. Resistive heating technology is the most mature of the myriad IR scene projection technologies available today; and hence is the most appropriate and realistic foundation on which to base the development of the next generation of high dynamic range IR scene projectors. Unfortunately, the materials used in fabricating existing generation of devices are not capable of withstanding the ultra-high temperatures required for the next generation of devices. Materials research for this application, performed in a phase 1 effort, has turned up several potential material systems that are expected to be stable at the extreme temperatures required for the next generation of devices (~2500 K or higher). The work outlined in this proposal is aimed at selecting the most promising of the material systems (and deposition techniques) based on process development, annealing experiments and measurements of the properties relevant to ultra-high temperature IRSP performance. Test pixel arrays will be fabricated and tested.

* information listed above is at the time of submission.

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