Light-Curing Structural Tape for In-Space Repair

Award Information
Agency:
National Aeronautics and Space Administration
Amount:
$70,000.00
Program:
SBIR
Contract:
NNM06AA46C
Solitcitation Year:
2005
Solicitation Number:
N/A
Branch:
N/A
Award Year:
2006
Phase:
Phase I
Agency Tracking Number:
054594
Solicitation Topic Code:
X12.03
Small Business Information
Adherent Technologies, Inc.
9621 Camino Del Sol NE, Albuquerque, NM, 87111-1522
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
859106296
Principal Investigator
 Ronald Allred
 Principal Investigator
 (505) 346-1685
 adherenttech@earthlink.net
Business Contact
 Susan Switzer
Title: Business Official
Phone: (505) 346-1685
Email: adherenttech@comcast.net
Research Institution
N/A
Abstract
NASA has numerous requirements for in-space repair capabilities to aid future missions beyond earth orbit. A subset of these requirements is adhesive patch materials that provide permanent or temporary repair of a wide variety of surfaces with minimal surface preparation. Prior work on light (UV and visible) curing composite matrix resins for rigidizing inflatable spacecraft shows that there is an opportunity to use similar technology for in-space repair kits. Light curing provides a controlled, clean, low power rigidization technology to harden repair patches. Rapid cure at low temperatures (-20?aC) has been demonstrated with these specialty resins. They are also low outgassing, 100 percent solids materials with no hazardous ingredients. Repair kits for light-curing tape can be tailored for a wide range of applications. This concept for !?structural duct tape!? provides a means of producing glass fabric repair patches impregnated with safe, visible light-curing resins that cure rapidly with low power using hand held light emitting diode (LED) arrays or similar light sources. The tape will be housed in a light and radiation resistant, easy to use dispenser. A companion battery powered LED array will complete the kit. Surface cleaning materials can also be included.

* information listed above is at the time of submission.

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