Light-Curing Structural Tape for In-Space Repair

Award Information
Agency:
National Aeronautics and Space Administration
Branch
n/a
Amount:
$50,000.00
Award Year:
2007
Program:
SBIR
Phase:
Phase II
Contract:
NNM07AA15C
Agency Tracking Number:
054594
Solicitation Year:
2005
Solicitation Topic Code:
X12.03
Solicitation Number:
n/a
Small Business Information
Adherent Technologies, Inc.
9621 Camino Del Sol NE, Albuquerque, NM, 87111-1522
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
859106296
Principal Investigator:
Ronald Allred
Principal Investigator
(505) 346-1685
reallred@comcast.net
Business Contact:
Susan Switzer
Business Official
(505) 346-1685
adherenttech@comcast.net
Research Institution:
n/a
Abstract
NASA has numerous requirements for in-space repair capabilities to aid future missions beyond earth orbit. A subset of these requirements is adhesive patch materials that provide permanent or temporary repair of a wide variety of surfaces with minimal surface preparation and that can operate in the space environment. This work will result in the production of a repair kit for in-space applications that forms structural composite patches rapidly and safely with low power. The proposed kit will consist of glass fabric impregnated with a UV light-curing resin stored in a protective dispenser. Cure will be accomplished using a portable, robust light-emitting diode (LED) array. Surface cleaning materials may also be included in the kit. The proposed material will adhere to a variety of surfaces and cure under a variety of environmental conditions including vacuum. Such a repair kit will provide a versatile repair technology for a wide variety of applications, which eliminates having redundant repair approaches in many cases. This work will extend the knowledge base previously attained with the development of similar light-curing materials for rigidization of inflatable spacecraft. That prior work will greatly benefit the development of the proposed repair kit and reduce programmatic risk.

* information listed above is at the time of submission.

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