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Dust Mitigation for the Lunar Surface

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: NNX09CE81P
Agency Tracking Number: 084542
Amount: $100,000.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: X5.02
Solicitation Number: N/A
Timeline
Solicitation Year: 2008
Award Year: 2009
Award Start Date (Proposal Award Date): 2009-01-22
Award End Date (Contract End Date): 2009-07-22
Small Business Information
9621 Camino Del Sol NE
Albuquerque, NM 87111-1522
United States
DUNS: 859106296
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Jan Gosau
 Principal Investigator
 (505) 346-1685
 adherenttech@comcast.net
Business Contact
 Susan Switzer
Title: Business Official
Phone: (505) 346-1685
Email: adherenttech@comcast.net
Research Institution
N/A
Abstract

The lunar surface is to a large extent covered with a dust layer several meters thick. Known as lunar regolith, it poses a hazard in the form of dust clouds being generated by all forms of gas expansions in the high vacuum environment of the lunar surface. This is especially pronounced during spacecraft operations. Instruments placed on the moon by the Apollo mission showed marked degradation due to damage from dust released during the lander's takeoff. Since there is no air movement to remove the dust after it is deposited, it is essential that dust is not displaced during everyday operations of a permanent lunar installation.

Adherent Technologies, Inc. (ATI) has over the last decade developed a number of specialty UV curing resins for NASA applications in space. ATI is proposing to develop a resin and dispenser system to coat large areas of lunar surface around landing pads and atmosphere locks with a thin, dust-stabilizing coating. The coating will be UV stable and elastic enough to weather the temperature extremes of a lunar day and night cycle. Special emphasis will be given to a low outgassing, solvent-free system that does not contaminate the lunar atmosphere.

* Information listed above is at the time of submission. *

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