On-Chip Optical Interconnector

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$69,973.00
Award Year:
2003
Program:
SBIR
Phase:
Phase I
Contract:
HQ00603C0057
Award Id:
64203
Agency Tracking Number:
031-0843
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
522 E. Jasper Dr., Gilbert, AZ, 85296
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
Chengping Wei
Senior Engineer
(480) 239-2149
cpwei@adianttechnology.com
Business Contact:
Ting Chen
President
(480) 496-4976
tchen@adianttechnology.com
Research Institution:
n/a
Abstract
The objective of this proposed SBIR phase I work is to design, build and therefore demonstrate the feasibility of an on-chip optical interconnector. This proposed device contains a molded plastic optical connector, a fiber ribbon, an on-chip opticalreceptacle, VCSEL, PIN diode (arrays for multiple-channel applications), and necessary electronic circuits, all in one compact unit. The design targets high bandwidth, low-cross talk, and low mechanical profile for on-chip implementation in today¿_s andnext generation high-performance computing systems. This device is expected to open up a new avenue for data communication and link between, e.g., central processing unit (CPU) and its peripheral counterparts at a speed and bandwidth otherwise impossiblewith the traditional printed circuit board (PCB). The proprietary design of this optical interconnector allows easy reconfiguration and manufacturing at low cost. With its superior data-link performance, the device is expected to find critical applicationsin a wide range of computing and smart electronics systems. The proposed on-chip optical interconnector is expected to find both commercial and military applications in a wide range of computing and smart electronics systems.

* information listed above is at the time of submission.

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