On-Chip Optical Interconnector

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ00603C0057
Agency Tracking Number: 031-0843
Amount: $69,973.00
Phase: Phase I
Program: SBIR
Awards Year: 2003
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
522 E. Jasper Dr., Gilbert, AZ, 85296
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Chengping Wei
 Senior Engineer
 (480) 239-2149
Business Contact
 Ting Chen
Title: President
Phone: (480) 496-4976
Email: tchen@adianttechnology.com
Research Institution
The objective of this proposed SBIR phase I work is to design, build and therefore demonstrate the feasibility of an on-chip optical interconnector. This proposed device contains a molded plastic optical connector, a fiber ribbon, an on-chip opticalreceptacle, VCSEL, PIN diode (arrays for multiple-channel applications), and necessary electronic circuits, all in one compact unit. The design targets high bandwidth, low-cross talk, and low mechanical profile for on-chip implementation in today¿_s andnext generation high-performance computing systems. This device is expected to open up a new avenue for data communication and link between, e.g., central processing unit (CPU) and its peripheral counterparts at a speed and bandwidth otherwise impossiblewith the traditional printed circuit board (PCB). The proprietary design of this optical interconnector allows easy reconfiguration and manufacturing at low cost. With its superior data-link performance, the device is expected to find critical applicationsin a wide range of computing and smart electronics systems. The proposed on-chip optical interconnector is expected to find both commercial and military applications in a wide range of computing and smart electronics systems.

* information listed above is at the time of submission.

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