Gas-Phase Deposition of Low Dielectric Polymers
Department of Defense
Missile Defense Agency
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Small Business Information
Advanced Technology Materials
7 Commerce Dr, Danbury, CT, 06810
Socially and Economically Disadvantaged:
Thomas H. Baum
AbstractPhase I will develop a gas-phase process for the deposition of low dielectric constant polymers for use in integrated circuits. This process will utilize the firm's liquid delivery technology to deliver the reactants and grow films at high deposition rates. Polymerization will be induced by thermal activation on a heated substrate. This novel approach to polymeric film growth enables the deposition of a wide variety of polymers displaying low dielectric constants. This technique has broad applications for IC packaging, lithography and microelectronics processing.
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