Radiation Tolerant Memory Device Materials

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: N/A
Agency Tracking Number: 28444
Amount: $59,979.00
Phase: Phase I
Program: SBIR
Awards Year: 1995
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
7 Commerce Dr, Danbury, CT, 06810
DUNS: N/A
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Jeffrey F. Roeder
 (203) 794-1100
Business Contact
Phone: () -
Research Institution
N/A
Abstract
Radiation hardened ferroelectric random access memory (FRAM) devices have potential uses in numerous military applications. Until recently, FRAMs have relied on lead zirconate titanate (PZT) as the storage material. However, a new class of materials promises to offer higher device reliability and easier integration into existing technologies. SrBi2Ta209 has been identified as a material of choice for this application, but current deposition technologies require high temperature post-anneals to bring about acceptable ferroelectric properties. Phase I will develop new MOCVD techniques to deposit SrBi2Ta209 at reduced temperatures. Metalorganic chemical vapor deposition (MOCVD) represents an optimum solution because it yields microcrystalline material of high quality, has high deposition rates, produces conformal coatings, and scales well to large areas. SrBi2Ta209 FRAMs have immediate military application for high radiation environments such as missile guidance systems and space systems. For the commercial market, the initial introduction at low device densities would impact existing EEPROM markets and new markets in identification tags for consumer goods. High density devices used in telecommunications will follow.

* Information listed above is at the time of submission. *

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