Computer-Aided Design Tools for Three-Dimensional Circuit Integration

Award Information
Agency: Department of Defense
Branch: Defense Advanced Research Projects Agency
Contract: DAAH0102CR133
Agency Tracking Number: 02SB1-0265
Amount: $98,863.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Solicitation Year: N/A
Award Year: 2002
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
11 Ward Street, Suite 400, Somerville, MA, 02143
DUNS: 002227291
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Lisa McIlrath
 President & CEO
 (617) 661-2905
Business Contact
 Lisa McIlrath
Title: President & CEO
Phone: (617) 661-2905
Research Institution
"R3 Logic, Incorporated proposes to perform a comprehensive study to develop a fullsuite of computer-aided design tools for three-dimensional circuit integration. Thecompany will build on its existing tool set that enables 3-D physical layout andverification and will develop recommendations for extending these tools to permitanalyses of 3-D circuit performance, including thermal and electromagnetic effects,to perform automated place and route, and to interface with automated tools fortop-down design and circuit synthesis from behavioral models. The proposed studywill focus on methodology and algorithmic development. In Phase II we will proposeto implement the recommendations of this study. The development of a powerful set of 3-D design and modeling tools is critical topromoting the advancement of three-dimensional circuit technology in thesemiconductor industry. 3-D circuits cannot be implemented without a 3-D processtechnology; and 3-D process technologies will not be available until there areoverwhelmingly convincing reasons to put them in place. The major benefit ofdeveloping modeling tools for 3-D circuit performance will be in providingquantitative demonstrations of the improvements achievable through multi-layerstacking and vertical interconnection. It will also ease the transition of VLSIdesigners into a 3-D world by providing examples of existing circuits optimizedfor 3-D."

* Information listed above is at the time of submission. *

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