Ultra-Dense Three-Dimensional Electronics for Space

Award Information
Agency:
Department of Defense
Branch
Air Force
Amount:
$99,986.00
Award Year:
2008
Program:
SBIR
Phase:
Phase I
Contract:
FA9453-08-M-0023
Agency Tracking Number:
F073-099-1641
Solicitation Year:
2007
Solicitation Topic Code:
AF073-099
Solicitation Number:
2007.3
Small Business Information
R3LOGIC, INC.
30 Fuller Rd., Lexington, MA, 02420
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
Y
Duns:
002227291
Principal Investigator:
Lisa McIlrath
President & CEO
(781) 652-0048
lmcilrath@r3logic.com
Business Contact:
Lisa McIlrath
President & CEO
(781) 652-0048
lmcilrath@r3logic.com
Research Institution:
n/a
Abstract
R3Logic, Inc., in collaboration with Tezzaron Semiconductor will develop a rad-hard multi-core embedded processor / memory system that will be fabricated in a multi-layer 3-D integrated circuit. Phase I will focus on the system design. We will complete the RTL to GDSII synthesis of the processor and system components. The stack will incorporate Tezzaron’s patented 3-D Octopus memory, which has built-in self-test and repair capability. In Phase II we will use Tezzaron’s 3-D process to fabricate a prototype device.

* information listed above is at the time of submission.

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