Ultra-Dense Three-Dimensional Electronics for Space

Award Information
Agency:
Department of Defense
Branch
Air Force
Amount:
$99,986.00
Award Year:
2008
Program:
SBIR
Phase:
Phase I
Contract:
FA9453-08-M-0023
Award Id:
86714
Agency Tracking Number:
F073-099-1641
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
30 Fuller Rd., Lexington, MA, 02420
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
002227291
Principal Investigator:
LisaMcIlrath
President & CEO
(781) 652-0048
lmcilrath@r3logic.com
Business Contact:
LisaMcIlrath
President & CEO
(781) 652-0048
lmcilrath@r3logic.com
Research Institute:
n/a
Abstract
R3Logic, Inc., in collaboration with Tezzaron Semiconductor will develop a rad-hard multi-core embedded processor / memory system that will be fabricated in a multi-layer 3-D integrated circuit. Phase I will focus on the system design. We will complete the RTL to GDSII synthesis of the processor and system components. The stack will incorporate Tezzaron's patented 3-D Octopus memory, which has built-in self-test and repair capability. In Phase II we will use Tezzaron's 3-D process to fabricate a prototype device.

* information listed above is at the time of submission.

Agency Micro-sites


SBA logo

Department of Agriculture logo

Department of Commerce logo

Department of Defense logo

Department of Education logo

Department of Energy logo

Department of Health and Human Services logo

Department of Homeland Security logo

Department of Transportation logo

Enviromental Protection Agency logo

National Aeronautics and Space Administration logo

National Science Foundation logo
US Flag An Official Website of the United States Government