Ultra-Dense Three-Dimensional Electronics for Space

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA9453-08-M-0023
Agency Tracking Number: F073-099-1641
Amount: $99,986.00
Phase: Phase I
Program: SBIR
Awards Year: 2008
Solicitation Year: 2007
Solicitation Topic Code: AF073-099
Solicitation Number: 2007.3
Small Business Information
30 Fuller Rd., Lexington, MA, 02420
DUNS: 002227291
HUBZone Owned: N
Woman Owned: Y
Socially and Economically Disadvantaged: N
Principal Investigator
 Lisa McIlrath
 President & CEO
 (781) 652-0048
 lmcilrath@r3logic.com
Business Contact
 Lisa McIlrath
Title: President & CEO
Phone: (781) 652-0048
Email: lmcilrath@r3logic.com
Research Institution
N/A
Abstract
R3Logic, Inc., in collaboration with Tezzaron Semiconductor will develop a rad-hard multi-core embedded processor / memory system that will be fabricated in a multi-layer 3-D integrated circuit. Phase I will focus on the system design. We will complete the RTL to GDSII synthesis of the processor and system components. The stack will incorporate Tezzaron’s patented 3-D Octopus memory, which has built-in self-test and repair capability. In Phase II we will use Tezzaron’s 3-D process to fabricate a prototype device.

* Information listed above is at the time of submission. *

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