A novel micro-channel heat exchanger for high heat flux electronics

Award Information
Agency:
Department of Defense
Branch
Navy
Amount:
$69,665.00
Award Year:
2003
Program:
STTR
Phase:
Phase I
Contract:
N00014-03-M-0295
Award Id:
65210
Agency Tracking Number:
N033-0297
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
3292 E. Hemisphere Loop, Tucson, AZ, 85706
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
602374951
Principal Investigator:
Ranji Vaidyanathan
Manager, Advanced Materials
(520) 434-6392
rkv@acrtucson.com
Business Contact:
Brett Waldo
Controller
(520) 573-6300
bwaldo@acrtucson.com
Research Institute:
UNIV. OF ARIZONA
Richard C Powell
P. O. Box 210012
Tucson, AZ, 85721
(520) 621-3513
Nonprofit college or university
Abstract
In this Phase I STTR program, a team consisting of Advanced Ceramics Research Inc. (ACR) and the University of Arizona (UA) propose to develop and optimize a novel, low-cost, integrated micro-channel heat exchanger system for high power electronicapplications. In radar and other applications involving power electronics, thermal dissipation from the electronics approach levels as high as 1000 W/cm2. In the proposed work, ACR and UA will use their patented extrusion freeform fabrication (EFF) rapidprototyping technology to fabricate micro-channel heat exchangers with optimized channel sizes to dissipate up to 1000 W/cm2 under two-phase (boiling) flow conditions. UA will test and analytically model the milli-and micro-channel heat exchangers intwo-phase (boiling) flow in order to assess the overall heat transfer coefficient of candidate geometries of heat exchangers and optimize their configuration to obtain thermal dissipation approaching levels as high as 1000 W/cm2 and demonstrate that themaximum temperature will rise to less than 125¿F at the junction level. This can then be used in both passive and actively pumped cooling systems. Improved cooling techniques are required for reliable electronics with current trends toward increasedpackaging densities and higher power levels for applications such as aircraft avionics, electric power systems, radar and weapon systems.

* information listed above is at the time of submission.

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