A novel micro-channel heat exchanger for high heat flux electronics

Award Information
Agency:
Department of Defense
Amount:
$69,665.00
Program:
STTR
Contract:
N00014-03-M-0295
Solitcitation Year:
N/A
Solicitation Number:
N/A
Branch:
Navy
Award Year:
2003
Phase:
Phase I
Agency Tracking Number:
N033-0297
Solicitation Topic Code:
N/A
Small Business Information
Advanced Ceramics Research, Inc.
3292 E. Hemisphere Loop, Tucson, AZ, 85706
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
602374951
Principal Investigator
 Ranji Vaidyanathan
 Manager, Advanced Materials
 (520) 434-6392
 rkv@acrtucson.com
Business Contact
 Brett Waldo
Title: Controller
Phone: (520) 573-6300
Email: bwaldo@acrtucson.com
Research Institution
 UNIV. OF ARIZONA
 Richard C Powell
 P. O. Box 210012
Tucson, AZ, 85721
 (520) 621-3513
 Nonprofit college or university
Abstract
In this Phase I STTR program, a team consisting of Advanced Ceramics Research Inc. (ACR) and the University of Arizona (UA) propose to develop and optimize a novel, low-cost, integrated micro-channel heat exchanger system for high power electronicapplications. In radar and other applications involving power electronics, thermal dissipation from the electronics approach levels as high as 1000 W/cm2. In the proposed work, ACR and UA will use their patented extrusion freeform fabrication (EFF) rapidprototyping technology to fabricate micro-channel heat exchangers with optimized channel sizes to dissipate up to 1000 W/cm2 under two-phase (boiling) flow conditions. UA will test and analytically model the milli-and micro-channel heat exchangers intwo-phase (boiling) flow in order to assess the overall heat transfer coefficient of candidate geometries of heat exchangers and optimize their configuration to obtain thermal dissipation approaching levels as high as 1000 W/cm2 and demonstrate that themaximum temperature will rise to less than 125¿F at the junction level. This can then be used in both passive and actively pumped cooling systems. Improved cooling techniques are required for reliable electronics with current trends toward increasedpackaging densities and higher power levels for applications such as aircraft avionics, electric power systems, radar and weapon systems.

* information listed above is at the time of submission.

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