Wafer-Wafer Transfer for Packaging and Assembly of MEMS

Award Information
Agency:
Department of Defense
Branch
Defense Advanced Research Projects Agency
Amount:
$99,000.00
Award Year:
1998
Program:
SBIR
Phase:
Phase I
Contract:
n/a
Agency Tracking Number:
41306
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
ADVANCED CMP PRODUCTS, INC.
825 Buckley Road, San Luis Obispo, CA, 93401
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
Michael Cohn
(805) 782-5453
Business Contact:
() -
Research Institution:
n/a
Abstract
The objective of this proposal is to demonstrate the feasibility of vacuum micro-packaging for devices such as MEMS gyroscopes and accelerometers. Vacuum is critical for high Q-factor, surface-micromachined MEMS. Robust, low-cost solutions are needed for applications such as guided munitions and unattended sensors. Proposed work focuses on long-term reliability issues, such as outgassing, permeation, and metallization stability. In addition, scale-up from our current chip-scale process to wafer-scale will constitute a key proof-of-concept.

* information listed above is at the time of submission.

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