Wafer-Wafer Transfer for Packaging and Assembly of MEMS
Small Business Information
825 Buckley Road, San Luis Obispo, CA, 93401
AbstractThe objective of this proposal is to demonstrate the feasibility of vacuum micro-packaging for devices such as MEMS gyroscopes and accelerometers. Vacuum is critical for high Q-factor, surface-micromachined MEMS. Robust, low-cost solutions are needed for applications such as guided munitions and unattended sensors. Proposed work focuses on long-term reliability issues, such as outgassing, permeation, and metallization stability. In addition, scale-up from our current chip-scale process to wafer-scale will constitute a key proof-of-concept.
* information listed above is at the time of submission.