Integrated Three Color Sensor for Simultaneous Fusion
Small Business Information
Advanced Device Technology,
3 Budway, Unit 29, Nashua, NH, 03063
Dr. Peter J. Kannam
AbstractWe propose to develop a Three Color HgCdTe Focal Plane Array with Built-In Image Fusion. The innovative features are: The detection of SWIR (.7-1.5um), MWIR (3-5um) and LWIR (8-13um) signals takes place in the same pixel. (Co-Located Pixel) Advanced CMOS readout circuitry is incorporated in the focal plane array to perform the signal processing of the three waveband signals in a simultaneous fashion. The design readily gives the capability for Image Fusion of the three colors. Multiple layers of HgCdTe material growth by OMVPE method is described. Detailed fabrication steps to achieve pixel co-location are shown. Advanced MUX design for triple band focal plane array is described. The proposed method is such that the cross talks between the three wavebands and the adjacent diodes are completely eliminated. During Phase I, preliminary experiments will be conducted to grow three color HgCdTe films. The fabrication method to achieve co-located array will be eliminated. During Phase II, 128x128 Element Staring Array with readout circuit will be fabricated and tested.
* information listed above is at the time of submission.