Co-Located Triple Pan QWIP Focal Plane Arrays
Small Business Information
Advanced Device Technology,
8 Raymond Ave, Suite #4, Salem, NH, 03079
Dr. Peter J. Kannam
AbstractWe propose to develop Co-located Triple Band Quantum Well Infrared Photodetectors (QWIP) Arrays. The innovative features are: Co-located Triple Band Structure The detection of short waveband (0.7-2.micro.m) midwaveband (3-5.micro.m) and long waveband (8-13.micro.m) signals takes in the same pixel (Co-located pixel). Simultaneous Detection of 3-Color Signals The design is such that detection of 3-Color signals is accomplished in a simultaneous fashion. Total Elimination of Cross-Talk The contact scheme is designed to eliminate the cross talk between the wavebands and cross talk between pixels. On-Chip Analog-to-Digital Convelter (ADC) An on-chip ADC is intearated with the readout circuits. We are presently developing Dual Band QWIP Arrays with On-Chip ADC for the Office of Naval Research. Under the proposed program, QWIP technology will be extended to fabricate Co-located Triple Band 256x256 Element QWIP Arrays. During Phase 2, prototype devices will be fabricated, tested, and delivered. The long range goal of the program during Phase 3 is to build imaging camera with Triple Band QWIP FPAs. The proposed approaches will yield a new category of triple band focal plane arrays. The design will allow major improvement in performance, cost, power consumption and reliability. The main commercial applications are: 1) remote sensing of environmental conditions, 2) medical imaging, 3) night vision equipments and 4) process control. The main military applications are: 1) missile seekers, 2) reconnaissance and 3) automatic threat control.
* information listed above is at the time of submission.