3D Integrated Full Color Microdisplays Based on InGaN/AlGaInP Semiconductor Microemitter Arrays

Award Information
Agency: Department of Defense
Branch: Army
Contract: W909MY-09-C-0014
Agency Tracking Number: A072-082-2377
Amount: $730,000.00
Phase: Phase II
Program: SBIR
Awards Year: 2009
Solicitation Year: 2007
Solicitation Topic Code: A07-082
Solicitation Number: 2007.2
Small Business Information
III-N Technology, Inc.
4627 5th Street, Lubbock, TX, 79416
DUNS: 017213773
HUBZone Owned: N
Woman Owned: Y
Socially and Economically Disadvantaged: N
Principal Investigator
 Jing Li
 R & D Director
 (785) 341-8354
Business Contact
 Jingyu Lin
Title: Co-Founder & Executive Ch
Phone: (785) 341-4484
Email: jylin@3n-tech.com
Research Institution
The goal of this SBIR project is to develop next generation inorganic semiconductor micro-emitter based emissive microdisplays with the following merits: (1) Much higher brightness and power efficiency (5 x) than the current filter based LCD and OLED microdisplays. (2) Resolution and pixel density higher than 15 ƒÝm per pixel with VGA, SVGA and higher format. (3) RGB narrow bandwidth (~ 25 nm) with high color fidelity and gamut exceeding the current display standard. (4) Broad full color tunability. (5) High gray scale. (6) Wide viewing angle (>120 o). (7) Pixel response on nanoseconds scale. (8) Robust and long lifetime. To achieve the above goals, the proposed architecture will be based on 3D integration of stacked semiconductor RGB micro-emitter pixels with silicon CMOS driver/processor. The RGB micro-emitters have a vertically stacked structure with full-color tunability, ensuring a minimum pixel size. They will be based on highly efficient InGaN for blue/green wavelength and AlGaInP for red wavelength emission, which are vertically integrated through thin-film transfer. The micro-emitter array will be bonded onto a silicon IC driver/processor substrate by flip-chip bonding and SiO2 based wafer bonding.

* information listed above is at the time of submission.

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