3D Integrated Full Color Microdisplays Based on InGaN/AlGaInP Semiconductor Microemitter Arrays

Award Information
Agency:
Department of Defense
Branch
Army
Amount:
$730,000.00
Award Year:
2009
Program:
SBIR
Phase:
Phase II
Contract:
W909MY-09-C-0014
Award Id:
81458
Agency Tracking Number:
A072-082-2377
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
4627 5th Street, Lubbock, TX, 79416
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
017213773
Principal Investigator:
Jing Li
R & D Director
(785) 341-8354
jingli@3n-tech.com
Business Contact:
Jingyu Lin
Co-Founder & Executive Ch
(785) 341-4484
jylin@3n-tech.com
Research Institution:
n/a
Abstract
The goal of this SBIR project is to develop next generation inorganic semiconductor micro-emitter based emissive microdisplays with the following merits: (1) Much higher brightness and power efficiency (5 x) than the current filter based LCD and OLED microdisplays. (2) Resolution and pixel density higher than 15 YYm per pixel with VGA, SVGA and higher format. (3) RGB narrow bandwidth (~ 25 nm) with high color fidelity and gamut exceeding the current display standard. (4) Broad full color tunability. (5) High gray scale. (6) Wide viewing angle (>120 o). (7) Pixel response on nanoseconds scale. (8) Robust and long lifetime. To achieve the above goals, the proposed architecture will be based on 3D integration of stacked semiconductor RGB micro-emitter pixels with silicon CMOS driver/processor. The RGB micro-emitters have a vertically stacked structure with full-color tunability, ensuring a minimum pixel size. They will be based on highly efficient InGaN for blue/green wavelength and AlGaInP for red wavelength emission, which are vertically integrated through thin-film transfer. The micro-emitter array will be bonded onto a silicon IC driver/processor substrate by flip-chip bonding and SiO2 based wafer bonding.

* information listed above is at the time of submission.

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