Feasibility of High Operating Temperature MWIR Type-II FPAs

Award Information
Agency:
Department of Defense
Amount:
$69,866.00
Program:
SBIR
Contract:
W15P7T-10-C-S602
Solitcitation Year:
2009
Solicitation Number:
2009.2
Branch:
Army
Award Year:
2010
Phase:
Phase I
Agency Tracking Number:
A092-083-0152
Solicitation Topic Code:
A09-083
Small Business Information
MP Technologies, LLC
1801 Maple Avenue, Evanston, IL, 60201
Hubzone Owned:
N
Woman Owned:
Y
Socially and Economically Disadvantaged:
N
Duns:
129503988
Principal Investigator
 Ryan McClintock
 Technical Director
 (847) 491-7208
 rmcclin@gmail.com
Business Contact
 Manijeh Razeghi
Title: President
Phone: (847) 491-7208
Email: asaylor@simtechinc.com
Research Institution
N/A
Abstract
Current high-performance MWIR FPAs require cooling to ~77K. This generally requires the use of a cryocooler that limits the system lifetime. If the FPA operation temperature can be raised to >170 K without sacrificing performance, then lower power and longer lifetime MWIR cameras should be possible. Type II InAs/GaSb superlattices represent the most promising material system capable of delivering a camera operating at T >170 K. High temperature operation of current MCT based FPAs is limited by inherent defects in the II-VI material and strong Auger recombination. Type-II is based upon more mature III-V materials and should give better material quality, lower substrate costs, and should be compatible with industrial III-V foundry processes. Type-II has significantly lower Auger recombination rates, and using the superlattice, the band structure can be engineered to further suppress Auger recombination. This should allow for lower dark currents at higher operating temperatures thereby allow for the development of a camera that can potentially achieve MCT performance at 170 K or greater. In this proposed work we will systematically study MWIR Type-II and apply recent innovations in order to demonstrate improved performance and pave the way for the development of a FPA camera is Phase II.

* information listed above is at the time of submission.

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