Hybrid SiC-SiC/C-SiC Thermal Protection Structural Material

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: W9113M-09-C-0073
Agency Tracking Number: B083-020-0107
Amount: $99,831.00
Phase: Phase I
Program: SBIR
Awards Year: 2009
Solicitation Year: 2008
Solicitation Topic Code: MDA08-020
Solicitation Number: 2008.3
Small Business Information
109 MacKenan Drive, Cary, NC, 27511
DUNS: 030936335
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Keith Sharp
 Senior Research Engineer
 (919) 481-2500
Business Contact
 Patty Pennell
Title: Corporate Accountant
Phone: (919) 481-2500
Email: pennellp@3TEX.com
Research Institution
Thermal protection materials for ballistic missile kill vehicles must retain strength and stiffness at temperatures around 1500-2000oC in an oxygen rich environment, and isolate payload electronics from excessive heating. Weight is a concern, since lighter weight translates to higher velocity and kinetic energy. Further, the TPS materials must have a long service life, including the ability to withstand low level impact loads. Ceramic matrix composites provide an appealing material choice, with high strength at temperature, light weight, and resistance to thermal shock and impact. SiC-SiC composites exhibit oxidation resistance up to 1600oC, where C-SiC composites exhibit oxidation resistance, as well as high strength up to 1600„aC in inert environments. 3TEX, in conjunction with COI Ceramics, proposes a hybrid CMC structural material that combines an outer skin of SiC/SiC and an inner skin of C/SiC based on a unitary 3-D braided preform. The SiC/SiC outer skin will act as the thermal protection system (TPS) while the C/SiC inner skin will provide high specific stiffness and strength. Further, the C/SiC can be manufactured with pitch carbon yarns oriented to draw heat away from the leading edge surfaces, without allowing heat through the thickness of the skin into the payload.

* Information listed above is at the time of submission. *

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