Micromachined Silicon Temperature Extreme Sensor Requiring No Power Source

Award Information
Agency: Department of Defense
Branch: Defense Advanced Research Projects Agency
Contract: N/A
Agency Tracking Number: 26459
Amount: $375,000.00
Phase: Phase II
Program: SBIR
Awards Year: 1995
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
311oo South Woodland Road, Pepper Pike, OH, 44124
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Ken Golaman
 (216) 831-5591
Business Contact
Phone: () -
Research Institution
The objective of this research is to design a micromechanical temperature sensor capable of recording temperature extremes experienced beyond a preset value without the use of electrical power. The temperature sensor's memory will be mechanically induced. The sensor will be either in an electronically resettable form, or, less expensively, in a disposable form. The proposed device will be microfabricated using integrated circuit(IC) and silicon micromachining techniques. As a result, the sensor will be electronically readable, inexpensive, and small. Anticipated Benefits: The sensor can be used in applications in which power source usage is impractical (e.g., in mobile personnell) and where expense must be limited (e.g., in shipping containers). In DoD applications, the proposed microsensor can be used for monitoring temperature exposure of personnel, food, and medical supplies in the field. Since the sensor will be small, it is well suited for such applications in which weight and size of added instrumentation is critical. Additionally, the sensor has many private sector applications; for example in shipping and tire industries.

* Information listed above is at the time of submission. *

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