HIGH-PERFORMANE HEAT SINKS BASED ON MEMS TECHNOLOGY

Award Information
Agency:
Department of Defense
Branch
Air Force
Amount:
$99,985.00
Award Year:
1998
Program:
SBIR
Phase:
Phase I
Contract:
n/a
Award Id:
41072
Agency Tracking Number:
41072
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
11000 CEDAR AVENUE, Cleveland, OH, 44106
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
Christopher Bang
(216) 229-4636
Business Contact:
() -
Research Institution:
n/a
Abstract
We propose high-performance heat sinks based on MEMS technology for cooling of advanced electronics. Our approach combines innovative designs, new microfabrication techniques, and high conductance materials resulting in extremely low thermal resistance and high heat load capacities in a compact and cost effective design, By using MEMS batch fabrication, the heat sinks can be made inexpensively, especially compared with complex forced liquid convention cooling systems made by conventional means. Furthermore, MEMS-based heat sinks will be smaller, lighter, and more amenable to incorporation into dense and space limited electronics systems than conventional heat sink technology. Opportunities exist for both passive and active cooling systems, in military and commercial electronics applications.

* information listed above is at the time of submission.

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