Switching Fabric Based on Multi-Level LVDS Compatible Interconnect

Award Information
Agency:
National Aeronautics and Space Administration
Branch
n/a
Amount:
$599,987.00
Award Year:
2005
Program:
SBIR
Phase:
Phase II
Contract:
NNG05CA10C
Award Id:
68931
Agency Tracking Number:
033192
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
28119 Ridgefern Court, Rancho Palos Verdes, CA, 90275
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
114422095
Principal Investigator:
VladimirKatzman
Principal Investigator
(310) 377-6029
traffic405@cox.net
Business Contact:
VladimirKatzman
President
(310) 528-2532
traffic405@cox.net
Research Institute:
n/a
Abstract
Switching fabric (SF) is the key component of the next generation of back plane interconnects. Low power, TID and SEU resistant and high bandwidth upgradeable communication between computer nodes are of utmost importance for future NASA missions. The current state off-the-art binary SF interconnect architectures have high power consumption and latency due to the necessity to perform internal data conversion and synchronization in order to recognize redundant bits and extract useful information from the data stream. The high power consumption of the SFs limit their application in the next generation of nano-satellites. In order to minimize latency and reduce power consumption, we propose a novel, robust, radiation tolerant and easy-to-align SF based on a multi-level power efficient Low Voltage Differential Signal interface. Our approach uses differential multilevel signals to mark a reference high-level bit position in one of the differential channels. Because the marked pilots will follow the high logic level in one of the differential outputs, they will regularly occur at the same bit position and ensure stable and easy recovery of the low-speed clock signal, which will be used as a reference for multi-channel data alignment and will synchronize high speed clocking circuitry using a standard clock multiplier technique.

* information listed above is at the time of submission.

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