SBIR Phase II: Low-Cost Hot Press Die Casting of Graphite-Metal Materials

Award Information
Agency: National Science Foundation
Branch: N/A
Contract: 0823012
Agency Tracking Number: 0637466
Amount: $499,734.00
Phase: Phase II
Program: SBIR
Awards Year: 2008
Solicitation Year: N/A
Solicitation Topic Code: MI
Solicitation Number: NSF 06-553
Small Business Information
ADVANCED THERMAL TECHNOLOGIES
91 S. STREET, UPTON, MA, 01568
DUNS: 140758561
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 James Connell
 PhD
 (508) 523-4371
 jconnell@charter.net
Business Contact
 James Connell
Title: PhD
Phone: (508) 523-4371
Email: jconnell@charter.net
Research Institution
N/A
Abstract
This Small Business Innovation Research (SBIR) Phase II project seeks to develop an unique hot press die casting technology to be used to produce graphite-metal materials. These materials will be used to produce packaging components for use in high power electronics packaging. There is a critical need for advanced materials with improved thermal properties capable of meeting the thermal management requirements of current and future high power electronic systems. The heat dissipation rate of electronic systems has increased dramatically, as a result of ongoing advances in semiconductor materials, compression of circuit physical architecture, size reduction of packaging envelops and faster switching speed. The technology developed in this project will enable the manufacture of cost effective graphite-metal packaging that offers improved thermal properties critical to thermal management solutions for next generation power electronics. The broader impact/commercial potential of this project will be the development of the hot press die casting technology for use in producing graphite-metal billet materials. The adoption and wide-spread use of the graphite-metal packaging products for electronic systems will enable commercial electronic devices based upon more efficient higher power semiconductor materials that will provide benefit to society in the form of more efficient, longer life electronics; reduced energy consumption; and improved environmental quality.

* information listed above is at the time of submission.

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