A Source-Integrated Micro-Cooling Device

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: DASG60-01-C-0077
Agency Tracking Number: 00-1193
Amount: $551,503.00
Phase: Phase II
Program: SBIR
Awards Year: 2004
Solicitation Year: 2000
Solicitation Topic Code: 00-015
Solicitation Number: 2000.2
Small Business Information
11890 Old Baltimore Pike Suite C, Beltsville, MD, 20705
DUNS: 837268481
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 John Lawler
 (301) 931-3221
Business Contact
 John Lawler
Title: President
Phone: (301) 931-3221
Email: J.Lawler@atec-ahx.com
Research Institution
Advanced Thermal and Environmental Concepts (ATEC Inc.), in collaboration with the University of Maryland, NASA Goddard Space Flight Center, and Thermacore, Inc., propose to develop and test a highly efficient, source integrated, ultra compact cooling device with broad applications in military and commercial sectors. An electrohydrodynamic (EHD)-enhanced ultra thin film evaporation concept is used to achieve high cooling rates with minimum pressure drop and power consumption penalties while benefiting from an on-line/on-demand feature for active control of the cooling surface temperature. The key innovations to obtain a low noise, high efficiency cooling system include: 1) a localized EHD micropump integrated into the sensor substrate, chip, or detector to be cooled reduces the pressure gradients and flow fluctuations in the system and 2) high heat transfer coefficients are achieved through combined thin film evaporation and EHD-enhanced pumping without transmission of any hydrodynamic or structural noise. Phase I efforts were successful in demonstrating the feasibility and performance of a micro-evaporator directly mounted on the back-side of a heat source. During Phase II, we will design and fabricate the other components required for an integrated cooling system, develop a functioning prototype, and demonstrate its superior capabilities.

* Information listed above is at the time of submission. *

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