A Novel Thermal Management Method for SiC Power Electronics

Award Information
Agency:
Department of Energy
Branch
n/a
Amount:
$99,955.00
Award Year:
2005
Program:
SBIR
Phase:
Phase I
Contract:
DE-FG02-05ER84309
Award Id:
72371
Agency Tracking Number:
79237S05-I
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
Advanced Thermal And Environmental Concepts, Inc. (Currently ATEC, Inc.)
387 Technology Drive, College Park, MD, 20742
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
John Lawler
Dr.
(301) 403-1744
j.lawler@atec-ahx.com
Business Contact:
John Lawler
Dr.
(301) 403-1744
j.lawler@atec-ahx.com
Research Institution:
n/a
Abstract
79237 Although solid-state power modules are becoming increasily important components in energy systems (e.g., wind turbines) and in vehicle propulsion systems (e.g., hybrid vehicles), the requirements for these power modules are beginning to exceed the limits of silicon-based power modules. Therefore, a switch to silicon carbide power modules, which can operate at higher operating temperatures and higher power loads, is critical to the deployment of many of these energy and vehicle systems. However, in order to take full advantage of the higher performance of silicon carbide power modules, new packaging and thermal management schemes will be required. This project will develop a novel packaging approach for silicon carbide power modules, which will not only improve thermal management but also allow the production of smaller, higher current, higher frequency power modules. By eliminating many of the interfacial layers currently used in silicon power modules, the approach also will improve manufacturing yield and operating reliability. In Phase I, the feasibility of the packaging concept will be demonstrated by assembling a silicon carbide die-ceramic cold plate, measuring its thermal resistance, and monitoring its thermal behavior during thermal cycling of the package. In Phase II, a complete silicon carbide power module, employing the new packaging will be fabricated and tested. Commercial Applications and Other Benefits as described by the awardee: The largest short-term commercial market is in the packaging of emerging SiC power modules. In addition major potential markets for power electronics include variable speed motor drives for hybrid vehicles ($12 billion annually), uninterruptible power suppliers ($5 billion annually), power supplies for computers and instruments ($11 billion annually), and distributed power (which includes inverters for photovoltaic and fuel cells, engine generator sets, wind and hydro turbines, welding power suppliers, industrial power supplies for metal and glass plating and coating; and lighting ballasts).

* information listed above is at the time of submission.

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