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SBIR Phase I: Non-Destructive Inspection Techniques to Significantly Improve the Manufacturability of KTP Waveguides

Award Information
Agency: National Science Foundation
Branch: N/A
Contract: 0638023
Agency Tracking Number: 0638023
Amount: $99,977.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: MI
Solicitation Number: NSF 06-553
Solicitation Year: 2006
Award Year: 2007
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
United States
DUNS: 062674630
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Christopher Kaleva
 (406) 522-0388
Business Contact
 Christopher Kaleva
Title: BS
Phone: (406) 522-0388
Research Institution

This Small Business Innovative Research project explores the feasibility of developing a manufacturing process that will both increase the rate of production and improve the yield of high quality waveguides in potassium titanyl phosphate (KTP). Waveguides in KTP are ideally suited for use in a wide variety of commercially significant laser-based applications, however, their widespread use has been limited due to cost and time associated with the current manufacturing methodology. The key innovation in this effort is to combine recent advances in non-destructive incoming wafer inspection with existing wafer level lithographic processing to increase the area for uniform waveguide fabrication (increased production). KTP waveguide technology has contributed to cutting edge research in a variety of fields including short pulse generation, wavelength stabilization and conversion, and photonics based quantum information science. Immediate commercial applications include pulsed and cw laser diode conversion to produce visible wavelengths for biomedical instrumentation. Low cost waveguides will also help enable new and emerging opportunities associated with quantum information science and secure communications, analog photonic circuits, and rapidly tunable Bragg stabilized diodes.

* Information listed above is at the time of submission. *

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