Nano-material Conducting Wires With Enhanced Electric/Thermal Conductivity and Mechanical Strength

Award Information
Agency: Department of Defense
Branch: Army
Contract: W56HZV-08-C-0096
Agency Tracking Number: A072-218-2985
Amount: $70,000.00
Phase: Phase I
Program: SBIR
Awards Year: 2008
Solicitation Year: 2007
Solicitation Topic Code: A07-218
Solicitation Number: 2007.2
Small Business Information
3300 A Westminister Ave., Santa Ana, CA, 92703
DUNS: 112614594
HUBZone Owned: N
Woman Owned: Y
Socially and Economically Disadvantaged: N
Principal Investigator
 Timothy Lin
 Scientist
 (714) 554-5511
 aegiste1400@earthlink.net
Business Contact
 Bob Liu
Title: President
Phone: (714) 554-5511
Email: bobliu@aegistech.net
Research Institution
N/A
Abstract
Small-size high power electronics is in the roadmap of the electronics from both military and civil application demands, especially for the military vehicles, where the complex vertronics are used in high vibration and harsh conditions. Hence the electrical cables, wires, circuit leads, contacts, and interconnects are being improved in three areas: (1) electrical conductivity for less heat generating and high power efficiency, (2) thermal conductivity for effective heat dissipation, and (3) mechanical strength resistant to harsh environment. Based on the results of the recent studies performed on the forming mechanism of the high strength and high conductivity (HSHC) nano material copper, Aegis Technology Inc. intends to develop a cost-effective processing technique derived from the ball-milling process under low temperature conditions in order to produce high volume HSHC Cu. Then from the produced bulk Cu, various dimensions from tenths of a micrometer to several millimeters of wires will be produced with enhanced mechanical strength (>5times) and high electrical conductivity (>80%) as compared to the pure coarse grain Cu.

* Information listed above is at the time of submission. *

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