Integrated Thermal Management and Wafer-Scale Packaging for High-Power VCSEL Diode Pump Arrays

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$99,996.00
Award Year:
2009
Program:
STTR
Phase:
Phase I
Contract:
HQ0006-09-C-7080
Agency Tracking Number:
B08B-011-0109
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
Aerius Photonics, LLC.
2223 Eastman Ave., Suite B, Ventura, CA, 93003
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
145925520
Principal Investigator:
Jon Geske
President
(805) 642-4645
geske@aeriusphotonics.com
Business Contact:
Michael MacDougal
Vice-President
(805) 642-4645
macdougal@aeriusphotonics.com
Research Institution:
Boise State University
Karen Henry
1910 University Drive
MS 1135
Boise, ID, 83725 1135
(208) 426-1574
Nonprofit college or university
Abstract
The performance of diode pumped solid state lasers (DPSSLs) is often limited by the performance of the diode laser arrays used to pump the crystal. Of the components making up the DPSSL module, the diode laser arrays consume the most power, dissipate the most waste heat per unit area and are among the most costly to manufacture and qualify. The performance of the diode laser pump array is limited by the ability of the packaging to extract heat away from the laser's active region, where the majority of the heat is generated. If the heat is not removed, the gain, and subsequently the output power and efficiency, of the entire DPSSL are decreased. Aerius Photonics proposes to develop a wafer-scale compatible process and packaging approach with improved thermal performance for high power Vertical Cavity Surface Emitting Laser (VCSEL) arrays. This approach will further improve the thermal performance and manufacturability of VCSEL technology and offer a 50% reduction in the laser diode heating by improving the waste heat transport and spreading from the semiconductor chip to the thermal management system.

* information listed above is at the time of submission.

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