Multifunctional Nanoscale Sensor Development for Cognitive Missiles

Award Information
Agency:
Department of Defense
Amount:
$119,550.00
Program:
SBIR
Contract:
W31P4Q-07-C-0043
Solitcitation Year:
2006
Solicitation Number:
2006.2
Branch:
Army
Award Year:
2006
Phase:
Phase I
Agency Tracking Number:
A062-036-2238
Solicitation Topic Code:
A06-036
Small Business Information
AET, INC.
1900 S. Harbor City Blvd., Suite 236, Melbourne, FL, 32901
Hubzone Owned:
Y
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
878400068
Principal Investigator
 Thomas Sanders
 President
 (321) 727-0328
 tsanders@aet-usa.com
Business Contact
 Thomas Sanders, Jr.
Title: Director of Operations
Phone: (321) 727-0328
Email: tjs@aet-usa.com
Research Institution
N/A
Abstract
The primary objective of this SBIR program is the development of approaches that provides for passive and active circuit component manufacturing to be used in missiles and other air vehicle multifunctional skin applications. The approach of AET, Inc. is to develop nanoscale sensors that can be integrated with a silicon-based integrated circuit for incorporation into the skin of cognitive missiles and other air vehicles. In the Phase I SBIR program, we will begin by developing the technology necessary to integrate nanoscale diamond films with the integrated circuit. In addition, AET will investigate additional sensors that may be integrated into the nanoscale sensor chip. Sensors fabricated with these technologies will use the analog and digital circuits built into the silicon chip to process data and readout information needed by the missiles and air vehicles. A preliminary design of a prototype nanoscale sensor chip will be completed. AET will also develop easy-to-use computer models for the nanosensors as a part of the development process. These new models will then be used to design new sensors that will meet the needs of the military. Computer simulations will be run to predict the performance of the nanosensors under a variety of environmental conditions.

* information listed above is at the time of submission.

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