Multifunctional Diamond Sensor Development for Cognitive Missiles

Award Information
Agency: Department of Defense
Branch: Army
Contract: W31P4Q-08-C-0081
Agency Tracking Number: A062-036-2238
Amount: $729,804.00
Phase: Phase II
Program: SBIR
Awards Year: 2008
Solicitation Year: 2006
Solicitation Topic Code: A06-036
Solicitation Number: 2006.2
Small Business Information
1900 S. Harbor City Blvd., Suite 236, Melbourne, FL, 32901
DUNS: 878400068
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Glenn Hess
 Chief Technical Officer
 (321) 727-0328
Business Contact
 Thomas Sanders, Jr.
Title: Chief Financial Officer
Phone: (321) 727-0328
Research Institution
The thrust of this program is to perform research and development that will result in diamond sensors that can be integrated with a silicon-based integrated circuit for incorporation into the skin of cognitive missiles and other air vehicles. These sensors will be fabricated on a silicon chip to allow readout of data in real time. AET will design sensor readout circuitry and have it fabricated by a semiconductor fabrication company. AET’s partner, Vanderbilt University will then fabricate diamond sensors on the silicon CMOS wafers. AET and Vanderbilt University have developed a detailed process strategy for integrating diamond sensors on a standard silicon IC chip. The primary technology task that remains to be accomplished is to develop the specific process variables that will allow the deposition of a diamond film that we believe give acceptable sensor characteristics and will not affect the operation of transistors and other components in the commercial silicon IC. At least two types of sensors, temperature and radiation, will be tested and characterized. Change of resistivity with temperature will be characterized as will the photoconductivity of the diamond sensors by using a laser technique for stimulating the devices in a similar way to the intended gamma radiation.

* Information listed above is at the time of submission. *

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