Multifunctional Diamond Sensor Development for Cognitive Missiles

Award Information
Agency:
Department of Defense
Branch
Army
Amount:
$729,804.00
Award Year:
2008
Program:
SBIR
Phase:
Phase II
Contract:
W31P4Q-08-C-0081
Award Id:
76893
Agency Tracking Number:
A062-036-2238
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
1900 S. Harbor City Blvd., Suite 236, Melbourne, FL, 32901
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
878400068
Principal Investigator:
Glenn Hess
Chief Technical Officer
(321) 727-0328
ghess@aet-usa.com
Business Contact:
Thomas Sanders, Jr.
Chief Financial Officer
(321) 727-0328
tjs@aet-usa.com
Research Institution:
n/a
Abstract
The thrust of this program is to perform research and development that will result in diamond sensors that can be integrated with a silicon-based integrated circuit for incorporation into the skin of cognitive missiles and other air vehicles. These sensors will be fabricated on a silicon chip to allow readout of data in real time. AET will design sensor readout circuitry and have it fabricated by a semiconductor fabrication company. AET's partner, Vanderbilt University will then fabricate diamond sensors on the silicon CMOS wafers. AET and Vanderbilt University have developed a detailed process strategy for integrating diamond sensors on a standard silicon IC chip. The primary technology task that remains to be accomplished is to develop the specific process variables that will allow the deposition of a diamond film that we believe give acceptable sensor characteristics and will not affect the operation of transistors and other components in the commercial silicon IC. At least two types of sensors, temperature and radiation, will be tested and characterized. Change of resistivity with temperature will be characterized as will the photoconductivity of the diamond sensors by using a laser technique for stimulating the devices in a similar way to the intended gamma radiation.

* information listed above is at the time of submission.

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