Materials Integration and Processing of Nonlinear Tunable Thin Films with Affordable Large Area Substrates to Promote Microwave Frequency (Ka band) Wa

Award Information
Agency:
Department of Defense
Branch
Army
Amount:
$729,110.00
Award Year:
2006
Program:
SBIR
Phase:
Phase II
Contract:
W911QX-06-C-0137
Award Id:
73859
Agency Tracking Number:
A052-026-0094
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
AGILE MATERIALS & TECHNOLOGIES, INC. (Currently AGILE RF, INC.)
93 Castilian Drive, Goleta, CA, 93117
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
081542636
Principal Investigator:
Roger Forse
Senior RF Engineer
(805) 968-5159
rforse@agilematerials.com
Business Contact:
Thomas Watson
VP of Sales
(805) 968-5159
twatson@agilematerials.com
Research Institution:
n/a
Abstract
Agile has successfully demonstrated the ability to design and manufacture high performance, voltage controllable analog millimeter wave phase shifters for use in phased array antennas using the ferroelectric material, Barium Strontium Titanate (BST) in thin film form. Agile has also performed pioneering work in the design and manufacture of phased array monolithic antennas manufactured on a single substrate. This work was performed for a commercial application, automotive anti-collision radar conformally mounted on the bumpers, but is ideally suited for the manufacture of cost-effective and scalable conformal antennas. Agile is proposing to develop a Ka band 2-D electronically scanned antennas on a single wafer containing the phase shifters, feed network and antenna radiating elements utilizing our BST technology and industry standard semiconductor manufacturing techniques. Our current substrate is 4" in diameter and less than 500 microns thick. These integrated antennas can be manufactured at a low cost. The Phase II proposal will focus on extending our work from Phase I and producing a 2-D monolithic scanning antenna manufactured on a single wafer. Phase II will involve three iterations of the design and will include development of a housing and control and drive circuitry.

* information listed above is at the time of submission.

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