Multi-Band / Multi-Threat Warning System with a Single Sensor

Award Information
Agency:
Department of Defense
Branch
Navy
Amount:
$69,975.00
Award Year:
2004
Program:
STTR
Phase:
Phase I
Contract:
N00014-04-M-0213
Award Id:
70428
Agency Tracking Number:
N045-016-0383
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
220 Ballardvale St., Suite D, Wilmington, MA, 01887
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
004841644
Principal Investigator:
Jack Salerno
VP of Technology
(978) 694-1006
jsalerno@agiltron.com
Business Contact:
Toni Scaglione
Contract Administrator
(978) 694-1006
tscaglione@agiltron.com
Research Institution:
University of Oklahoma
Dan G Davis
660 Parrington Oval, Room 201, Office of Technology Dev.
Norman, OK, 73019
(405) 325-3800
Nonprofit college or university
Abstract
Agiltron and University of Oklahoma jointly propose a revolutionary multi-band/multi-threat warning system having intrinsic advantages in sensitivity, speed, energy efficiency, reliability, and cost as compared with the competitive approaches. The device integrates three-band detection and identification within a single sensor, eliminating the need of pixel registration and data fusion from multiple sensors while providing fast operation speed capable of over one hundred frames per second for each of the three bands. Equipped with Agiltron's proprietary 360-degree FOV fisheye lens and a 512x512 MEMS IR sensor array, the system can provide better than 1-degree over a field of view of 360-degrees in azimuth and in elevation (-10-degrees to +60-degrees). Moreover, the design is simple, compact, lightweight, low power consumption, rugged, and long operating life. The innovation is based on pixel-level integration of micro-machined thermal-mechanical and optical-reflective structures of bi-materials that directly convert an IR image into a visible image. The design incorporates direct optical readout, which eliminates the drawback of electronic means that inevitably introduces chip complexity and additional signal loss due to thermal contact made to the detector element.

* information listed above is at the time of submission.

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