Hermetic-Equivalent Wafer-Scale Packaging of Radiation-Hardened Semiconductors for Use In Strategic Missile Guidance Systems

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N00178-03-C-3006
Agency Tracking Number: N011-0273
Amount: $0.00
Phase: Phase I
Program: SBIR
Awards Year: 2002
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
Aguila Technologies, Inc.
310 Via Vera Cruz, Suite 107, San Marcos, CA, 92069
DUNS: 957992522
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Robert Burress
 Director Advanced Packagi
 (760) 752-1195
 rburress@aguilatech.com
Business Contact
 M. Albert Capote
Title: President
Phone: (760) 752-1199
Email: macapote@aguilatech.com
Research Institution
N/A
Abstract
"Guidance systems used on sea-based vehicles are often stored forlong periods of time (10 to 30 years) under a variety ofuncontrolled storage and operational conditions. The electronicsare util-ized during the life of the system and must operate witha high degree of reliability when they are needed. The Navyanticipates a need for radiation-hardened ICs in packages thatwill ensure reli-ability and performance over long lifetimes.Ceramic-packaged hermetic circuits, currently used in themajority of missile systems, generally do not suffer from many ofthe common failure mecha-nisms, but they are quickly becomingobsolete as the military share of the overall electronics mar-ketcontinues to shrink. Current plastic-encapsulated die approacheshave not been proven reliable under long-term unpowered storagein harsh environments. To make plastic encapsulated die a viablealternative to ceramic packaged devices, an inexpensive yeteffective protection scheme must be developed to eliminate commonfailure mechanisms. This proposal entails application andqualification testing of a novel pre-encapsulated semiconductordie packaging approach that pro-vides superior ruggedness and issuitable for high-reliability defense environments. Notable ad-vances in materials and processes for wafer-scale pre-encapsulation and assembly have already been made, providing alow-risk path for implementation of prototypes.BENEFITS: The needs of missile guidance, space, and a

* information listed above is at the time of submission.

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