Low Temperature Sintered Conductive Adhesives for use in the Packaging of High-Power Electronics

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$69,937.00
Award Year:
2003
Program:
SBIR
Phase:
Phase I
Contract:
HQ00603C0063
Award Id:
64241
Agency Tracking Number:
031-0463
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
310 Via Vera Cruz, Suite 107, San Marcos, CA, 92069
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
AlanGrieve
Scientist, Technical Staf
(760) 752-1192
agrieve@aguilatech.com
Business Contact:
MAlbert Capote
President
(760) 752-1193
macapote@aguilatech.com
Research Institute:
n/a
Abstract
There is a growing need for improvement in the performance of thermally and electrically conductive polymeric adhesives used in electronic packaging. In particular, there are few polymeric materials that are suitable for replacing eutectic solder bondingin electronic devices used in high-temperature environments, such as the operating environment of high power wide bandgap electronic devices. Polymeric electrically conductive adhesives are usually comprised of silver flake dispersed in a polymer resin.The high level of silver flake required to impart the material with good electrical and thermal conductivity properties significantly impacts the long term reliability of the material, particularly when exposed to harsh, high-temperature environments. Wehave developed a low-temperature sintering adhesive that, with some modification, will address these performance issues. Our unique formulation incorporates a novel polymeric resin that can be tailored to cure rapidly over a varied temperature range. It issolvent-free and easily processed. Incorporation of a combination of suitable alloy powders in this resin formulation will also allow the preparation of composite adhesives capable of forming metallurgical connections to a variety of metal surfaces. Suchadhesives will have electrical and thermal conductivity properties similar to solder materials but with the processing advantages of current polymeric adhesives. There is an immediate need for adhesive materials with improved high temperature performancein a myriad of high volume consumer and defense products, particularly those materials that have improved thermal and/or electrical properties. The market today exceeds over $100 Million annually. This demand is increasing with the development of advancedhigh power electronics systems used for the processing and control of high-energy electrical systems.

* information listed above is at the time of submission.

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