Sintered Conductive Adhesives for use in Active Radar System Thermal Management

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N00024-05-C-4104
Agency Tracking Number: N042-163-0437
Amount: $100,000.00
Phase: Phase I
Program: SBIR
Awards Year: 2004
Solicitation Year: 2004
Solicitation Topic Code: N04-163
Solicitation Number: 2004.2
Small Business Information
310 Via Vera Cruz, Suite 107, San Marcos, CA, 92078
DUNS: 957992522
HUBZone Owned: N
Woman Owned: Y
Socially and Economically Disadvantaged: Y
Principal Investigator
 Alan Grieve
 Principal Investigator
 (760) 752-4359
Business Contact
 M. Capote
Title: President
Phone: (760) 752-1199
Research Institution
Current Naval microwave power amplifiers operate at power densities around 200-500 W/cm2. Amplifiers under development may operate at 2-4 times this power density. Despite the development of active cooling technologies, the principal technology for removing heat from a chip remains thermal conduction. In most power devices, solders, such as AuSn, are used for die attach bonding. Solder is not adaptable to high volume, low cost processing. There is a critical need from T/R module developers for improvement in the performance of thermally conductive polymeric materials used in electronic packaging. There are few candidate polymeric materials for replacing eutectic solder bonding in electronic devices used in high-temperature environments. Most polymeric electrically conductive adhesives are not capable of long term reliability in such environments. We have demonstrated a low-temperature sintering adhesive that, with modification, will address these performance issues. Based on a novel polymeric resin formulation, they are solvent-free and easily processed. A unique combination of alloy powders in this resin formulation allows the preparation of composite adhesives capable of forming metallurgical connections to suitable metal surfaces. These may be optimized to have electrical and thermal conductivity properties similar to solder materials but with the processing advantages of polymeric adhesives.

* information listed above is at the time of submission.

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