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High-Speed Interconnects Over Copper Traces

Award Information
Agency: Department of Defense
Branch: Defense Advanced Research Projects Agency
Contract: W31P4Q-06-C-0069
Agency Tracking Number: 05SB2-0336
Amount: $98,998.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: SB052-021
Solicitation Number: 2005.2
Solicitation Year: 2005
Award Year: 2006
Award Start Date (Proposal Award Date): 2006-01-26
Award End Date (Contract End Date): 2006-09-29
Small Business Information
310 Via Vera Cruz, Suite 107, Suite 107
San Marcos, CA 92078
United States
DUNS: 957992522
HUBZone Owned: No
Woman Owned: Yes
Socially and Economically Disadvantaged: Yes
Principal Investigator
 M. Albert Capote
 Principal Investigator
 (760) 752-1199
Business Contact
 M. Capote
Title: President
Phone: (760) 752-1199
Research Institution

As technology trends towards higher system data rates with reduced size and cost, the ability to create high-speed electrical interconnections at low cost is becoming critical. High-speed I/O, integrated along with high I/O parallellicity, is allowing interconnects to achieve over 1Tb/s of total chip-to-chip data rates. These rates are on a rapid upward trend, increasing at a rate of about 20% per year. As this trend continues, chips with many hundreds of parallel 20 Gb/s I/Os will be on the scene within the next five years. In order to compensate for the inadequacies of the inter-connect technologies, chip manufacturers are integrating low-jitter clock circuits, adaptive equali-zation and multilevel signaling into chip I/O. However, the high non-recurring costs involved in such approaches can only be afforded by the highest volume applications. Using commercial materials and printed circuit manufacturing methods, this proposed program will develop an inex-pensive technology for increasing the bandwidth of copper traces on printed circuits. The ap-proach involves using novel networks to optimize each data channel at the design stage using conventional design tools. Our techniques will permit creation of copper-clad printed circuits using conventional materials, such as FR4, yet support single channel data rates in excess of 10Gb/s.

* Information listed above is at the time of submission. *

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