A Hydrostatic Processing Facility for Superconducting Wire

Award Information
Agency: Department of Energy
Branch: N/A
Contract: DE-FG02-03ER83602
Agency Tracking Number: 72984S03-I
Amount: $99,958.00
Phase: Phase I
Program: SBIR
Awards Year: 2003
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
P.O. Box 2470, Huntsville, AL, 35804
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 John Hendricks
 (256) 536-8629
Business Contact
 Mary Hendricks
Phone: (256) 536-8629
Email: aceinc@mindspring.com
Research Institution
72984S03-I Currently available methods impose limits on the processing of multi-filamentary, superconducting wires used in high energy physics experiments. These limits can be severe when one of the wire components has a mechanical strength substantially smaller than the other component(s), and can eliminate many desirable wire designs from consideration. Niobium-Tin and Niobium-Aluminum are examples of systems that exhibit this problem. Recent experimental work has shown that hydrostatic reduction, using low-angle dies and relatively large-area reductions (greater than 4:1), can produce good results with a much wider range of material mechanical strengths; in particular, jelly roll structures including niobium, copper, and tin have been processed successfully. Yet, when these same systems were processed using cold drawing, the results were unacceptable. Based on these results, this project will develop new wire architectures that can produce high current densities (> 3,000 A/mm2 @ 4.2K and 12T) with small effective filament diameters (< 10 microns) in Niobium-Tin superconductors. Hydrostatic processing, with high area reductions per pass, will be used for all processing, from the initial billet to the final wire size. In Phase I, a hydrostatic facility for processing wire-sized material will be designed. The wire will be coiled in a relatively large-inside-diameter pressure vessel (6¿

* Information listed above is at the time of submission. *

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