SBIR Phase I: Micro-Compliant-Interconnect-Mechanisms (MCIMs)

Award Information
Agency:
National Science Foundation
Branch
n/a
Amount:
$99,969.00
Award Year:
2008
Program:
SBIR
Phase:
Phase I
Contract:
0810548
Agency Tracking Number:
0810548
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
ALCES TECHNOLOGY, INC.
650 West Elk Ave #8, JACKSON, WY, 83001
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
137198862
Principal Investigator:
David Bloom
PhD
(307) 732-1994
dbloom@alcestech.com
Business Contact:
David Bloom
PhD
(307) 732-1994
dbloom@alcestech.com
Research Institution:
n/a
Abstract
This Small Business Innovation Research Phase I research project investigates the feasibility of using Micro-Compliant-Interconnect-Mechanisms (MCIMs) to provide chip level communication to Micro-Electro-Mechanical-Systems (MEMS) devices. MCIMs are microscopic spring connectors fabricated directly on silicon wafers which provide an alternative to soldered flip chip technology for interconnecting individual dies in multi chip modules. Evolving MEMS designs have led to increasingly high-density devices. Providing reliable inter-die electrical interconnections to high density MEMS represents a substantial portion of the overall complexity of these devices. The MCIM connection technology described in this project offers to dramatically reduce the cost of packaged MEMS devices making them available to a much broader market. The broader impact of this technology is that MCIMs represent a novel solution to the challenge of providing high density inter-die electrical connections in devices utilizing multi-chip module architectures. The higher yields and lower production costs provided by MCIMs will lead to new market opportunities for MEMS based laser light modulators. The high costs and relatively low per wafer yields of these devices restrict their use to high end markets. Other applications of MCIMs include the development of micro-probes for use in semiconductor testing.

* information listed above is at the time of submission.

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