STTR Phase I: Improved Boron Nitride Materials for Enhanced Thermal Management

Award Information
Agency:
National Science Foundation
Branch
n/a
Amount:
$100,000.00
Award Year:
2005
Program:
STTR
Phase:
Phase I
Contract:
0512932
Award Id:
73433
Agency Tracking Number:
0512932
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
11711 Chase Court, Westminister, CO, 80020
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
JohnFerguson
Dr.
(303) 318-4146
john.ferguson@aldnanosolutions.com
Business Contact:
KarenBuechler
(720) 840-1610
buechler@aldnanosolutions.com
Research Institute:
University of Colorado at Boulder
Alan W Weimer
3100 Marine Street, Rm. 481, 572 UCB
Boulder, CO, 80309
(303) 492-3759
Nonprofit college or university
Abstract
This Small Business Technology Transfer Phase I project provides for the manufactureof improved boron nitride (BN) filler materials for electronic thermal management applications. Novel Atomic Layer Deposition (ALD) nanocoating is used to selectively functionalize edges only or edges/basal planes to improve wetting of BN platelets with resin encapsulants. The improved wetting allows for significantly reduced viscosity (~ 5 times less) of BN/resin mixtures during processing and improved interfacial adhesion in the cured composite. These improvements are realized using an ultra-thin (nm thick), conformal, pin-hole free, chemically bonded alumina nanofilm on individual BN platelets that provides for an improvement in rheological properties without a significant reduction in thermal conductivity. Hence, higher BN loadings in filled composites will allow for significantly improved heat dissipation in electronic packaging materials, particularly in the case of glob top coatings and potting compounds. Individual fine sized BN platelet particles will be selectively nanocoated (edges only or edges/basal planes) with chemically bonded Al2O3 films of ~50, 25, 12.5, 6.3, 3.2, 1.6, and 0.8 nanometer thickness. The nanocoated BN will be blended at a 40 volume % loading in a liquid encapsulant mixture (will measure viscosity), cured, and tested for thermal conductivity and peel strength. Commercially this addresses one of the most pressing problems in the electronics industry, namely the heat dissipation required by the use of faster and more powerful chips. Since boron nitride has one of the best thermal conductivities as a filler, any improvement in its performance can positively address this problem. Furthermore the potential impact of successful large scale processing extends far beyond this proposed microelectronics packaging application. Nanoscience will only achieve true "disruptive" technology status if the individual surfaces of ultrafine particles can be functionalized. ALD nanocoating of ultrafine particles provides such an opportunity. It is now possible to produce ultrafine particles with designed electrical, magnetic, optical, mechanical, rheological, or other properties. Markets for such functionalized ultra-fine powders include microelectronics, defense, hard metals, cosmetics, drug delivery, energetic materials, and polymer/ceramic nanocomposites, among others. A better understanding of the nanocoating of ultra-fine particles and its cost/performance value will be developed.

* information listed above is at the time of submission.

Agency Micro-sites


SBA logo

Department of Agriculture logo

Department of Commerce logo

Department of Defense logo

Department of Education logo

Department of Energy logo

Department of Health and Human Services logo

Department of Homeland Security logo

Department of Transportation logo

Enviromental Protection Agency logo

National Aeronautics and Space Administration logo

National Science Foundation logo
US Flag An Official Website of the United States Government