STTR Phase I: Atomic Layer Deposition-Enabled Polymer Packaging for Integrating MEMS and Electronics

Award Information
Agency: National Science Foundation
Branch: N/A
Contract: 0539890
Agency Tracking Number: 0539890
Amount: $100,000.00
Phase: Phase I
Program: STTR
Awards Year: 2006
Solicitation Year: 2005
Solicitation Topic Code: EL
Solicitation Number: NSF 05-557
Small Business Information
580 Burbank Street, Unit 100, Broomfield, CO, 80020
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 John Ferguson
 (303) 318-4146
Business Contact
 Karen Buechler
Phone: (303) 318-4142
Research Institution
 Univ of CO Boulder
 Yung-Chen Lee
 3100 Marine Street
Boulder, CO, 80309
 (303) 492-3393
 Nonprofit college or university
This Small Business Technology Transfer (STTR) Phase I project will demonstrate a new nano-scale, conformal, atomic layer deposition (ALD)-enabled hermetic capping. Such an innovative capping technology will transform MEMS and electronics integration from dual-in-line packages (DIP) into chip-scale packages (CSP), wafer level packages (WLP) and three-dimensional (3-D) packages, which are required for low-cost and super-compact systems. MEMS devices are mechanically protected by polymer layers with cavities. Polymer processing is fully compatible with existing WLP manufacturing for microelectronic components. To meet hermetic and/or vacuum requirements, a nano-scale (25 to 60 nm) ALD-alumina layer with a hydrophobic surface monolayer will be coated to provide comprehensive, conformal, pinhole-free protective coverage. This project will demonstrate the feasibility of this innovative concept by using a MEMS package sealed by a polymer structure coated with ALD-alumina and hydrophobic monolayer. The project will also demonstrate a product insertion process by transforming microelectronic non-hermetic CSPs into hermetic ones. The project will be applied to various CSPs produced by different manufactures. Commercially, packaging is recognized as one of the major barriers to the large scale commercialization of Micro-Electro-Mechanical Systems (MEMS). Wafer-level hermetic capping has enabled the integration of MEMS and electronics in dual-in-line (DIP) packages. This project creates a new paradigm to apply ALD for packaging of MEMS, microelectronic, optoelectronic and radio frequency (RF) components and systems. The potential impact of successful ALD applications to packaging extends far beyond the proposed hermetic sealing.

* Information listed above is at the time of submission. *

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