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Machine Diagnostics System on a Chip

Award Information
Agency: Department of Defense
Branch: Defense Microelectronics Activity
Contract: H94003-11-P-1101
Agency Tracking Number: 11-1A2
Amount: $99,999.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: DMEA102-001
Solicitation Number: 2010.2
Timeline
Solicitation Year: 2010
Award Year: 2010
Award Start Date (Proposal Award Date): 2010-11-10
Award End Date (Contract End Date): 2011-04-11
Small Business Information
4415 Euclid Avenue Suite 500
Cleveland, OH 44103
United States
DUNS: 557510336
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Mike Willett
 Project Engineer
 (216) 649-0399
 willett@orbitalresearch.com
Business Contact
 Joseph Snyder
Title: Vice President
Phone: (216) 649-0399
Email: snyder@orbitalresearch.com
Research Institution
N/A
Abstract

The diagnostic systems in use in military machines are large and expensive. Other military machines could benefit from diagnostic and prognostic systems, but cannot afford the added size, weight and expense. Orbital Research proposes to address this issue by adapting the rugged ASICs that it has presently in development, and those planned for future development, into a single System on a Chip (SoC) using 3D IC stacking capability that is presently under development with Air Force SBIR funding. The SoC would incorporate all the required diagnostic and prognostic capability required by a variety of military applications. The SoC would reduce system size and cost while improving performance and reliability. With Silicon-on-Insulator process, each chip is isolated from the substrate by an insulating oxide layer of oxide forming superior isolating properties over semiconductor junction isolation (JI) or other forms of dielectric isolation (DI). By fabricating the ASICs using SOI technology, the operational temperature limit is increased to over 200°C, a key parameter in providing the ruggedness required for many of the machine diagnostic applications.

* Information listed above is at the time of submission. *

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