Microscopic Damage Detection and Remaining Life Assessment of Printed Circuit Boards

Award Information
Agency:
Department of Defense
Branch
Navy
Amount:
$100,000.00
Award Year:
2004
Program:
SBIR
Phase:
Phase I
Contract:
M67854-04-C-3012
Award Id:
69828
Agency Tracking Number:
N032-0389
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
44 Hunt Street, Watertown, MA, 02472
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
073804411
Principal Investigator:
Timothy Tiernan
Dir. of Advanced Instrume
(617) 926-1167
TTiernan@RMDInc.Com
Business Contact:
Gerald Entine
President
(617) 926-1167
GEntine@RMDInc.Com
Research Institution:
n/a
Abstract
Field inspection of printed circuit boards (PCB), and assessment of their condition is critical for the readiness of military equipment. A new technology is needed that is portable and able to inspect PCBs, yet can perform sophisticated characterization of defects, and predict the remaining life of the electronics. The technology proposed by RMD could revolutionize the nondestructive evaluation (NDE) of PCBs and circuit components using inspection at the microscopic level to predict aging effects in PCBs. The technology is based on the use of a two-dimensional, high density array of microscopic MR (magnetoresistance) sensors for detection and mapping of both induced magnetic fields, and electric currents in PCBs and components. Analysis of the magnetic fields allows detection and imaging, at the microscopic level, of parameters such as electrical continuity, trace thinning, short circuits, and aging effects. The defects will be mapped and imaged in three-dimensional space so that the localized electrical parameters can be correlated with the nature and severity of the defect. RMD has assembled a team with the technical expertise, and experience to successfully develop the proposed technology. When fully realized, the new technology will detect defective circuitry, and analyze the reliability of critical DoD systems.

* information listed above is at the time of submission.

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