Microscopic Damage Detection and Remaining Life Assessment of Printed Circuit Boards

Award Information
Agency: Department of Defense
Branch: Navy
Contract: M67854-05-C-6500
Agency Tracking Number: N032-0389
Amount: $1,750,000.00
Phase: Phase II
Program: SBIR
Awards Year: 2005
Solicitation Year: 2003
Solicitation Topic Code: N03-158
Solicitation Number: 2003.2
Small Business Information
44 Hunt Street, Watertown, MA, 02472
DUNS: 073804411
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Timothy Tiernan
 Group Leader
 (617) 926-1167
Business Contact
 Gerald Entine
Title: President
Phone: (617) 926-1167
Email: GEntine@RMDInc.com
Research Institution
Inspection of printed circuit boards (PCB) to detect and repair defects is critical for the readiness of military equipment. A new technology is needed to perform sophisticated characterization of defects, and predict the remaining life of electronics without costly, PCB and IC specific hardware and software. The technology proposed by RMD could revolutionize the nondestructive evaluation (NDE) of PCBs and ICs with non-contact inspection at the microscopic level to analyze defects and predict aging effects. The technology is based on the use of a two-dimensional, high density array of microscopic MR (magnetoresistance) sensors for detection and mapping of magnetic fields related to electric currents in PCBs, ICs and components. Analysis of the magnetic fields allows detection and imaging, at the microscopic level, of parameters such as electrical continuity, trace thinning, short circuits, defect parts, and aging effects. The defects will be mapped in three-dimensional space to correlated electrical parameters with the nature and severity of defects. RMD has assemble a team with the technical expertise, and experience to successfully develop the proposed technology. When fully realized, the new technology will detect defective circuitry, and analyze the reliability of critical DoD systems.

* Information listed above is at the time of submission. *

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