System for Analyzing Microscopic Defects and Defect Propagation Due to Aging

Award Information
Agency:
National Aeronautics and Space Administration
Amount:
$100,000.00
Program:
SBIR
Contract:
NNL07AA68P
Solitcitation Year:
2006
Solicitation Number:
N/A
Branch:
N/A
Award Year:
2007
Phase:
Phase I
Agency Tracking Number:
066208
Solicitation Topic Code:
A1.03
Small Business Information
Radiation Monitoring Devices, Inc.
44 Hunt St, Watertown, MA, 02472-4699
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
073804411
Principal Investigator
 Timothy Tiernan
 Principal Investigator
 (617) 668-6800
 TTiernan@RMDInc.com
Business Contact
 Gerald Entine
Title: President
Phone: (617) 668-6801
Email: GEntine@RMDInc.com
Research Institution
N/A
Abstract
New technology is needed for sensing and characterizing incipient defects, and assessing the effects of aging in aerospace components. Next generation materials, including nickel-based superalloys that are exceedingly difficult to inspect with existing technology are being adopted by designers and manufacturers. The ability to ascertain the remaining life of a spacecraft component, and develop mitigation procedures to improve safety and reliability, are critical. RMD proposes a revolutionary new imaging technology based on microscopic, solid-state sensors, magnetic imaging and "eddy current mapping". The new nondestructive evaluation (NDE) technology will be used to detect, map and characterize nano-scale cracks and corrosion in superalloys and metallic components. The data will be used to develop an accurate model for the prediction of defect propagation resulting from aging. The NDE technology will improve spacecraft integrity and safety, reduce the cost and complexity of inspection, and characterize incipient defects and defect propagation. It can be used during materials selection and testing and for evaluating components in the field as they age. The technology taxonomy areas addressed by this proposal include: avionics and astrionics, information, materials, sensors and sources, structures, and verification and validation.

* information listed above is at the time of submission.

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