Advanced Carbon-Based Fan Duct Heat Exchanger

Award Information
Agency:
Department of Defense
Branch
Air Force
Amount:
$99,999.00
Award Year:
2003
Program:
SBIR
Phase:
Phase I
Contract:
F33615-03-M-5021
Award Id:
62380
Agency Tracking Number:
F031-1795
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
ALLCOMP, INC. (Currently Allcomp Corporation)
209 Puente Ave., City of Industry, CA, 91746
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
026249487
Principal Investigator:
Wei Shih
President
(626) 369-4572
weishih@aol.com
Business Contact:
Wei Shih
President
(626) 369-4572
weishih@aol.com
Research Institution:
n/a
Abstract
High conductivity (Hi-K) Carbon foam and Carbon-Carbon (C-C) composites are light-weigh and offers the highest specific thermal conductivity (conductivity/ density) among various engineering materials. Carbon foam and C-C have been identified as ideal corematerials for medium to high temperature heat exchangers. However, Hi-K carbon foam is relatively brittle and exhibit low strength. In this proposal, a fan-duct surface-type heat exchanger using structurally enhanced carbon foam and Hi-K C-C heat transfersfins is proposed. The proposed design is relatively simple and maximizes the usage of state-of-the-art carbon foam and Hi-K C-C materials. A surface-type heat exchanger also offers significantly lower risk in manufacturing and in operation. In thisproposal, critical technical issues are identified and innovative design and process are proposed. Enhancements in both structural integrity and thermal conductance through interfaces will be investigated. Assuming a successful demonstration of theproposed technology, a highly efficient carbon-based heat exchanger can be designed and fabricated.A successful demonstration of a surface-type fan duct heat exchanger using structurally enhanced carbon foam and high conductivity C-C will lead us to many new applications. Since the proposed fan duct heat exchanger design concept may be converted into astandardized module, it can easily be scaled up with minimum modification to handle higher thermal load as required by larger military fan duct heat exchangers. Since the proposed design is relatively simple to fabricate, the production cost maybesignificantly reduced if volume requirement increase. A low-cost light-weigh high-performance heat exchanger can find many commercial applications in both aerospace and non-aerospace applications.

* information listed above is at the time of submission.

Agency Micro-sites


SBA logo

Department of Agriculture logo

Department of Commerce logo

Department of Defense logo

Department of Education logo

Department of Energy logo

Department of Health and Human Services logo

Department of Homeland Security logo

Department of Transportation logo

Enviromental Protection Agency logo

National Aeronautics and Space Administration logo

National Science Foundation logo
US Flag An Official Website of the United States Government