A Light Weight High Flux Cooling Module

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: N0017803C1087
Agency Tracking Number: 031-0834
Amount: $69,777.00
Phase: Phase I
Program: SBIR
Awards Year: 2003
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
209 Puente Ave., City of Industry, CA, 91746
DUNS: 026249487
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Mike Wang
 Research Scientist
 (626) 369-1273
Business Contact
 Wei Shih
Title: President
Phone: (626) 369-4572
Email: weishih@aol.com
Research Institution
Recent advancement in both commercial and military electronic devices, such as radar T/R modules, solid state motor drivers, RF power amplifiers, advanced microprocessor among others demands for advanced thermal management systems to maintain their highoperation performance. A light weight high heat flux cooling module is proposed for current and future thermal management of instruments and devices in aerospace, defense and other fields. Its feasibility will identified and related important technicalissues will be explored and solved, a cooling module prototype will be fabricated for thermal management of radar systems and other high power electronic devices and its cooling capability will be verified by prototype testing during Phase I. A successfuldemonstration of the proposed technology will further improve the performance and reliability of current and next generation high power electronic components and devices. The proposed technology has significant commercial values in fields of powerelectronics, optics, military electronics, computer and telecommunication.The accomplishment of the proposed research and development will efficiently improve performance and reliability of current and next generation semiconductor devices in electronics, optics, computer and communication. It will benefit to improvement andminiaturization of radar and communication systems among others. The developed technology has high commercial potentials in fields of power electronics, solid state lasers, military electronics, computer and communication. The proposed cooling module andits derivatives maybe used in both DoD related and many advanced commercial applications where high power density, weight and volume are mainly concerned. In addition, the proposed concept may also be used in nuclear related applications.

* Information listed above is at the time of submission. *

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