A Light Weight High Heat Flux Cooling System for Solid State Lasers

Award Information
Agency: Department of Defense
Branch: Defense Advanced Research Projects Agency
Contract: W31P4Q-04-C-R240
Agency Tracking Number: 04SB1-0551
Amount: $98,999.00
Phase: Phase I
Program: SBIR
Awards Year: 2004
Solicitation Year: 2004
Solicitation Topic Code: SB041-032
Solicitation Number: 2004.1
Small Business Information
209 Puente Ave., City of Industry, CA, 91746
DUNS: 026249487
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Mike Wang
 Staff Scientist
 (626) 369-1273
Business Contact
 Wei Shih
Title: President
Phone: (626) 369-4572
Email: weishih@aol.com
Research Institution
High-performance and high-power electronic semiconductor devices, such as solid state lasers, solid state motor drivers, RF power amplifiers, radar T/R modules among others, are used extensively in military and commercial applications. As the devices get more powerful while their volumes and weights are reduced continuously, there is an urgent need to develop advanced high heat flux cooling technologies for current and future high power density devices. A light weight high heat flux cooling system is proposed for current and future high average power solid state lasers. Its feasibility will identified and related key technical issues will be investigated; an advanced evaporator will be prototyped for cooling a high power laser diode array and its cooling capability will be verified by prototype testing during Phase I. The proposed cooling system will be designed and its performance will be analyzed and improved. A successful demonstration of the proposed technology will provide a powerful and reliable approach for current thermal management challenge in high energy laser development. Furthermore it will improve the performance and reliability of other high power electronic components and devices. The proposed technology has significant commercial values in fields of power electronics, optics, military electronics, material processing and machining.

* Information listed above is at the time of submission. *

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