Advance Liquid-Cooled Avionics Enclosure

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA8650-06-C-5057
Agency Tracking Number: F051-128-1996
Amount: $749,992.00
Phase: Phase II
Program: SBIR
Awards Year: 2006
Solitcitation Year: 2005
Solitcitation Topic Code: AF05-128
Solitcitation Number: 2005.1
Small Business Information
209 Puente Ave., City of Industry, CA, 91746
Duns: 026249487
Hubzone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Wei Shih
 (626) 369-1273
Business Contact
 Wei Shih
Title: President
Phone: (626) 369-1273
Research Institution
Composite avionics enclosures with liquid-cooled card guides are predicted to weigh less than current state-of-the-art aluminum enclosure. While there are many successes in developing composite-based Thermal Planes for advanced avionics applications, limited effort has been spent on the enclosure and significantly less on the card guide. The objective of this program is to design, fabricate and qualify a functional and light-weight composite avionics enclosure equipped with liquid-cooled card guides for high-power electronic modules currently being used on many advanced military aircrafts. Our initial effort will be focused on the development of advanced card guides using high-conductivity carbon-based materials. A typical card guide consists of card rails and an integrated heat exchanger. There are three critical thermal resistances along the entire thermal path – module to rail, rail to heat exchanger and heat exchanger to ambient. We propose to use high conductivity carbon material for the rail and to develop a high performance heat exchanger using advanced carbon-based materials for the core. We propose to evaluate subscale prototype card guides initially. Once it is proven, we plan to integrate the composite card guides with a full-size composite enclosure frame to be designed and fabricated for a selected application for performance evaluation.

* information listed above is at the time of submission.

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