Advanced Thermal Solutions for High Power Tactical Radios

Award Information
Agency: Department of Defense
Branch: Army
Contract: W15P7T-06-C-F810
Agency Tracking Number: A052-104-1546
Amount: $69,982.00
Phase: Phase I
Program: SBIR
Awards Year: 2005
Solicitation Year: 2005
Solicitation Topic Code: A05-104
Solicitation Number: 2005.2
Small Business Information
209 Puente Ave., City of Industry, CA, 91746
DUNS: 026249487
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Wei Shih
 (626) 369-1273
Business Contact
 Wei Shih
Title: President
Phone: (626) 369-1273
Research Institution
Allcomp proposes to develop innovative thermal solutions based on advanced carbon-based material and composite technologies that have broad-based appeal in solving a number of thermal management applications in high power and small form factor tactical radios. Comparing to metallic options, high conductivity carbon-based materials and composites are light providing passive and reliable solutions to thermal problems in microelectronics. Advances in power management are needed to offset increases in transmitted power, anticipated in future needs of the Army's Joint Tactical Radio System. Anticipated heat rejection on the order of 240W for short periods, from a confined space that possibly will lack a source of convective cooling is expected. Allcomp's approach is to apply our recent experiences in cooling high heat flux components using highly conductive carbon-based materials and composites and in direct coupling of energy storage-phase change materials to the heat source to handle power transients. This approach offers the potential to be a very lightweight, highly reliable, yet affordable concept. The proposed study will cover small and large tactical radios, land base and aircraft installation, where vibration is an issue. In remote heat sinking situations, Allcomp will also leverage our experience in high temperature radiator using heat pipes and loop-heat pipes technology for transporting heat.

* Information listed above is at the time of submission. *

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