Advanced Compact Condenser for Electronics Cooling

Award Information
Agency: Department of Defense
Branch: N/A
Contract: N00014-08-M-0123
Agency Tracking Number: O081-EP7-4118
Amount: $99,919.00
Phase: Phase I
Program: SBIR
Awards Year: 2008
Solitcitation Year: 2008
Solitcitation Topic Code: OSD08-EP7
Solitcitation Number: 2008.1
Small Business Information
ALLCOMP, INC.
209 Puente Ave., City of Industry, CA, 91746
Duns: 026249487
Hubzone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Bill Miller
 Sr. Vice President
 (626) 369-1273
 bill.miller@allcomp.net
Business Contact
 Wei Shih
Title: President
Phone: (626) 369-1273
Email: weishih@aol.com
Research Institution
N/A
Abstract
Innovative thermal management approaches are required to address the increasing demand of safely dissipating large amounts of heat from very small electronic component. Removal of waste heat via evaporative cooling technologies presents the best opportunity to enable the integration of high power electronic systems into future military platforms where size, weight, and efficiency are a premium. Advanced cooling technologies, such as microchannel and spray cooling technologies have demonstrated heat transfer coefficients in excess of 105 W/m2K and with low pumping powers. In order to fully realize system level benefits, similar advances in condenser technology are required. Innovative compact condensers are urgently required. A compact high performance condenser requires high and comparable heat transfer coefficients on both the refrigerant-side and the coolant-side. Innovative technologies, such as drop-wise condensation, microchannel cooling, and advanced cooling using high conductivity carbon-based materials are identified for further evaluation on performance, repeatability and durability. Prototype condenser using the most promising technologies will be fabricated and tested.

* information listed above is at the time of submission.

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