Pulsed Arc Molecular Beam Deposition (PAMBD) Tool for High Quality Films and Coatings

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: DAAD19-03-C-0003
Agency Tracking Number: 35762
Amount: $1,148,190.00
Phase: Phase II
Program: SBIR
Awards Year: 2005
Solicitation Year: 1997
Solicitation Topic Code: BMDO97-016
Solicitation Number: 1997.3
Small Business Information
c/o University at Buffalo Rese, Amherst, NY, 14228
DUNS: 007708613
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Robert Deleon
 Technical Director & VP
 (716) 639-0632
Business Contact
 Robert DeLeon
Title: Technical Director & VP
Phone: (716) 639-0632
Research Institution
In the Phase I SBIR effort, AMBP Tech developed a new film deposition technology, Pulsed Arc Molecular Beam Deposition (PAMBD). This new approach to depositing films offers substantial advantages over many existing deposition technologies. We propose to optimize and perfect this technology in a Phase II effort. We will use strategic Collaborations (some providing in-kind services and some providing cash funding) to demonstrate that PAMBD produces superior quality films at economical costs for commercial applications. During the Phase I program a prototype PAMBD source was successfully constructed and tested, depositing a variety of different film types. In this technique, an electrical discharge pulse generated the plasma plume of the material to be deposited and a synchronized gas pulse thermalizes the arch-generated flux and helps direct it to the deposition surface. The resulting material is expanded (optionally through a nozzle) to form a pin-hole and particulate free film that is uniform in thickness and composition, as required in thin film applications. The Phase II program will be devoted to engineering this technique into a viable production technology for thin films, with a focus oxides, nitrides and carbides for rapid commercialization in semiconductors, optics and tribological applications.

* Information listed above is at the time of submission. *

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